Product features:
1. Lightweight design, low coefficient of expansion, high thermal conductivity
2. High hardness, excellent wear resistance and stability
3. Extremely high flatness and purity, meeting the requirements of high standard working conditions
4. Support customized structural dimensions, adsorption methods, and materials as needed
Product parameters:
Applicable wafer size | 2-12 inches |
Flatness | 0.3—0.5um |
Structure characteristics | Pin type, ring type, composite type |
Adsorption method | Vacuum adsorption type, Bernoulli suction cup (customizable) |
Texture of material | Silicon carbide, infiltrated silicon carbide, silicon nitride, and aluminum nitride, etc |
Characteristic | Low coefficient of expansion, high thermal conductivity, high hardness, and high stability |
Application area | Suitable for semiconductor processing equipment, wafer measurement equipment, defect detection equipment, etc |
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