Product features:
1. Supports single arm and double arm configurations
2. Rich in styles, including vacuum adsorption, edge clamping, flipping, stacking, Bernoulli suction cup
3. All models have unified interface standards and are compatible with most robots, making it more convenient to exchange them
4. Support customized structural dimensions, clamping methods, and materials as needed
Product parameters:
Support wafer size | 2-12 inches |
Clamping method | Vacuum adsorption type, edge clamping type, flipping type, Bernoulli suction cup type (customizable) |
Cleanliness | Class 1 |
Texture of material | Aluminum oxide, ceramics, carbon fiber, etc |
Characteristic | High temperature resistance, corrosion resistance, wear resistance, and high insulation |
Application area | Suitable for gripping and handling semiconductor (wafer), LED (sapphire substrate), optoelectronic (glass) and other products |
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