Product features:
1. Adopting self-developed micro single axis robot module to achieve high-speed, efficient, and high-precision wafer calibration
2. Embedded integrated design, no need for external controllers and wiring space, compact size, and compact structure
3. Equipped with a self-developed wafer automatic alignment system and control system, it quickly completes correction actions such as wafer center and angle, achieving rapid wafer positioning with a positioning accuracy of 0.1mm
4. Equipped with high-performance optical sensors, compatible with positioning calibration of transparent, semi transparent, opaque and other products, suitable for wafer, glass and other products with a size of 100-300mm
5. Equipped with real-time monitoring functions such as drive control system, sensing system, vacuum system, circulation system, etc
Product parameters:
Wafer size | 2-6 inches | Wafer material | Transparent, semi transparent, opaque |
Number of motion axes | 3-axis（X/Y/θ） | Carrying method | Vacuum adsorption |
Positioning accuracy | ＜±0.1mm | Notch angle | ＜±0.2° |
Cleanliness | Class 1 | Power Supply | DC 24V；2A |
Application area | Suitable for calibration and positioning of semiconductors (wafers), LEDs (sapphire substrates), optoelectronics (glass), etc | ||
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