Emerging from the Breakthrough: The New Force of Domestic Semiconductor Equipment

Amid the global semiconductor industry's accelerating evolution towards high-end and intelligent manufacturing, the autonomy and control of core equipment have become the key to determining the industry's lifeline. For a long time, the market for precision equipment in the semiconductor manufacturing sector has been monopolized by international giants, and domestic enterprises have faced dual challenges of technological blockades and supply chain security. Founded in 2023, Huzhou Prim Semiconductor Co., Ltd., with its core technology of nanometer-level ultra-precision motion control, has built a comprehensive precision solution covering the entire process of wafer processing within just three years, emerging as a pioneering force in the rise of domestic semiconductor equipment. 

As an innovation pioneer in the domestic semiconductor equipment field, Prim Semiconductor focuses on nanometer-level ultra-precision motion control technology. Taking core equipment such as precision motion stages, wafer alignment stages, air-bearing rotation axes, and wafer transfer systems as its key points, it provides stable and precise domestic alternative solutions for the key links in chip manufacturing, promoting the gradual reduction of China's reliance on foreign equipment in the semiconductor industry. 

Precision motion stage: The core carrier of nanometer-level accuracy 

Precision motion stages are one of the core components of semiconductor manufacturing equipment, and their accuracy directly affects the processing quality and yield of chips. In the current era when 7nm and below advanced processes have become the mainstream in the industry, the accuracy requirements for motion stages in chip manufacturing have reached the nanometer level, which poses extremely high challenges to the design, materials, and control technology of the equipment. 

Primus Semiconductor's precision motion stage adopts advanced air bearing technology, achieving non-contact motion based on aerodynamic principles. By inputting filtered compressed air into the bearing cavity, a rigid air film is formed between the motion stage and the support surface, completely eliminating mechanical contact friction. This enables the motion stage to perform displacement with extremely high precision and stability. This design not only keeps the radial runout of the motion stage as low as 0.025 microns but also effectively reduces heat and wear caused by friction, significantly extending the service life of the equipment. 

To further enhance the motion accuracy, Prim Semiconductor has integrated laser interferometry vibration measurement and active vibration suppression technology into the control system of the motion stage. By real-time monitoring the vibration signals during the motion process, the system can quickly adjust the air film pressure and motion parameters, effectively offsetting the errors caused by external disturbances and the vibration of the equipment itself, ensuring that the motion stage can still maintain nanometer-level positioning accuracy under complex working conditions. In addition, the motion stage is also equipped with a high-precision grating feedback system, which can collect position data in real time and feed it back to the control system, achieving precise closed-loop control of the motion trajectory. 

Wafer alignment stage: The "Precision Navigator" in Chip Manufacturing 

In the semiconductor manufacturing process, wafer alignment is a core step for achieving high-precision overlay of multi-layer circuit patterns, and its accuracy directly affects the size of the device and the manufacturing yield. As the process technology advances towards 3nm and below, the control requirements for the three-dimensional structure of the photoresist pattern and the inter-layer alignment accuracy have reached an unprecedented level. Even slight deviations can lead to the failure of device functions. 

Prim Semiconductor's wafer alignment stage integrates advanced visual recognition and precise positioning technology, enabling rapid and accurate alignment of wafers. The equipment employs a dual-visual system, which captures the notches or marker points on the wafer's edge through high-resolution cameras, and then uses image algorithms to calculate the positional deviation of the wafer, with an accuracy reaching one-thousandth of a human hair. After the deviation calculation is completed, the high-precision linear motor of the alignment stage will drive the wafer for real-time adjustment, ensuring that the final positioning error does not exceed ±0.001 millimeters. 

To address the stability issues during high-speed movement and positioning, Prim Semiconductor's wafer alignment stage also features excellent anti-vibration capabilities. During the design phase, various external interference factors were fully considered, and a high-rigidity mechanical structure and active vibration isolation technology were adopted. This effectively counteracts the impact of environmental vibrations and equipment operation, ensuring stable alignment accuracy even under complex working conditions. Additionally, the alignment stage is compatible with multiple alignment mark types, meeting the diverse requirements of different processes and customers. 

Air flotation rotating shaft: The power core of ultra-precision rotation 

In key processes such as wafer cutting, inspection, and grinding, the precision and stability of rotating equipment directly determine the processing quality. Traditional mechanical rotating components, due to the presence of contact friction, are prone to vibration and wear, making it difficult to meet the processing requirements of nanometer-level precision. Prim Semiconductor's air-float rotating shaft adopts gas static pressure bearing technology, providing an ideal solution for ultra-precision rotary motion. 

The working principle of the air-floatation rotating shaft is to inject high-pressure gas into the bearing interior, forming a uniform air film between the shaft neck and the bearing ring, allowing the rotating shaft to float inside the bearing and achieve contactless rotation. This design completely eliminates mechanical friction, not only enabling the rotating shaft to reach speeds of tens of thousands of revolutions per minute or even higher, but also controlling the radial runout accuracy within 0.1 microns, ensuring the smoothness and precision of the rotation process. 

In response to the processing requirements of brittle materials such as silicon carbide, Prim Semiconductor's air-bearing spindle can maintain a runout accuracy within 1 micron at a high speed of 100,000 rpm, effectively suppressing axial jitter and vibration, and ensuring the precision and smoothness of wafer cutting. Additionally, the air-bearing spindle has excellent temperature adaptability and can operate stably within a wide temperature range from -265°C to 1650°C, meeting the demands of various process scenarios. 

Wafer transfer system: The "high-efficiency conveyor belt" in chip manufacturing 

The wafer transfer system plays a crucial role in the semiconductor manufacturing process. It serves as a bridge connecting various process equipment and is responsible for the efficient and safe transfer of wafers between different processes. As the degree of automation in semiconductor production lines continues to increase, the efficiency, accuracy, and stability of the transfer system directly impact the overall production capacity and product quality of the entire production line. 

Prim Semiconductor's wafer transfer system (EFEM) is a complete automated solution that integrates multiple modules such as wafer handling robots, wafer aligners, and data tracking systems, enabling efficient wafer transfer, substrate handling, and data management. The system features a six-axis robot structure for the wafer handling robot, which offers multi-degree-of-freedom flexible operation capabilities. It incorporates feedback control functions through high-precision sensors, not only enhancing the transfer speed but also allowing real-time monitoring and adjustment during the transfer process to ensure the safety and stability of the wafers throughout the entire transmission. 

To meet the diverse needs of different customers, Prim Semiconductor's wafer transfer system features a high degree of customization. Customers can flexibly select peripheral accessories such as Wafer ID reading, boat box RFID sensing, wafer edge correction, and bump detection according to their process requirements, achieving seamless integration with existing production lines. Additionally, the system is equipped with adaptive pressure detection and 24-hour continuous tracking and monitoring functions, which can record the wafer's transfer path and processing status in real time, providing strong data support for production management and quality control. 

Independent innovation: Leading the future of domestic semiconductor equipment 

In today's increasingly fierce global competition in the semiconductor industry, independent innovation is the core driving force for Chinese semiconductor equipment enterprises to achieve breakthroughs. Since its establishment, Prim Semiconductor has always adhered to technological innovation as its guiding principle, continuously exploring in the field of nanometer-level ultra-precision motion control, and has obtained multiple core technology patents, accumulating valuable technical experience for the development of domestic semiconductor equipment. 

In the future, as semiconductor manufacturing processes continue to advance towards more sophisticated levels, the demand for precision equipment will also increase. Prim Semiconductor will continue to focus on the research and development of nanometer-level ultra-precision motion control technology, constantly improving the accuracy and stability of its products, and providing stronger support for the independent control of China's semiconductor industry. At the same time, the company will also strengthen cooperation with upstream and downstream enterprises in the industrial chain, jointly promoting the coordinated development of China's domestic semiconductor equipment industry, and contributing Chinese strength to the diversified development of the global semiconductor industry.