Analysis of Core Products of Huzhou Prim Semiconductor

Amid the global semiconductor industry's accelerating evolution towards high-end and intelligent manufacturing, the autonomy and control of core equipment have become the key to determining the industry's lifeline. For a long time, the market for precision equipment in the semiconductor manufacturing sector has been monopolized by international giants, and domestic enterprises have faced dual challenges of technological blockades and supply chain security. Founded in 2023, Huzhou Prim Semiconductor Co., Ltd., with nanometer-level ultra-precision motion control technology at its core, has built a comprehensive precision solution covering the entire process of wafer processing within just three years, emerging as a pioneering force in the rise of domestic semiconductor equipment. 

I. Corporate Foundation: Dual Drive of Technology and Team 

The core team of Huzhou Prim Semiconductor originated from top domestic research institutes and has been deeply engaged in the fields of complex robot system control, ultra-precision manufacturing and processing, and nanometer-level motion control for many years, possessing profound technical accumulation and industry experience. The company received angel-round financing from professional investment institutions at its inception and again obtained tens of millions of yuan in investment in 2025, injecting strong impetus into technological research and development and capacity expansion. 

By 2025, the company's revenue had exceeded 60 million yuan, with R&D investment accounting for over 20%. It has established a total of approximately 10,000 square meters of R&D and production bases in Wuxi and Huzhou, equipped with advanced clean laboratories and ultra-precision processing workshops. The proportion of technical personnel engaged in software and hardware design and development is as high as 60%, and it is equipped with high-precision imported CNC machine tools, dual-frequency laser interferometers and other high-end equipment, laying a solid foundation for product R&D, production, debugging and quality control. 

II. Wafer Transfer System: The Intelligent Bridge for Wafer Flow 

The wafer transfer system is an indispensable core equipment in the semiconductor manufacturing process, responsible for efficiently and precisely transferring wafers between various production processes. It acts as the "nerve center" of chip production, connecting the entire process from raw material processing to finished product packaging. With advanced manufacturing processes becoming the industry norm, the requirements for wafer handling in terms of accuracy, stability, and cleanliness have reached extremely strict standards at the nanometer level. 

The wafer transfer system of Huzhou Prim Semiconductor achieves a perfect combination of high speed and high precision through highly automated process design and precise servo control. The system adopts multiple transmission methods, and users can choose pneumatic transmission, electric drive transmission or vacuum adsorption and other solutions according to specific needs. Meanwhile, the equipment structure has been optimized to reduce its own dynamic interference, ensuring that the wafers are not damaged during the transfer process and effectively reducing the errors caused by manual operations. 

As an automated bridge connecting wafer storage and process equipment, this system is widely deployed at the entrances of core process equipment such as lithography, etching, and chemical vapor deposition. It systematically integrates modules such as wafer robots, loading ports, aligners, and control systems, and is an indispensable part of achieving fully automated material flow in wafer fabrication plants. 

III. Air Floatation Spindle: The Core Support of Ultra-Precision Machining 

Among the numerous critical processes in semiconductor manufacturing, the air bearing spindle, with its high precision, frictionless and low-vibration characteristics, has become a core component in wafer cutting, inspection, grinding/thinning and other stages. The ultra-precision air bearing spindle independently developed by Huzhou Primex Semiconductor adopts advanced air bearing technology. Under the action of compressed air, the spindle achieves complete suspension and contactless rotation, fundamentally eliminating mechanical wear. 

The rotational runout accuracy of this equipment has been stably maintained within 1 micron for a long time, significantly extending its service life and greatly reducing maintenance costs and downtime risks. Its nanometer-level rotational accuracy can meet the strict requirements of advanced processes for wafer processing, ensuring that the precision control of each process reaches the top level in the industry. 

IV. Ceramic Wafer Fork: The Safety Guardian for Wafer Handling 

In the vacuum, high-temperature and corrosive gas environment of semiconductor manufacturing, the performance of wafer handling tools directly affects the yield of chips. The ceramic wafer forks of Huzhou Prim Semiconductor are made of high-performance ceramic materials and have excellent high-temperature resistance and corrosion resistance. They can maintain stable performance in various complex working conditions. 

Through fine processing and surface treatment, the ceramic wafer fork not only enhances its strength and wear resistance, but also effectively reduces the damage rate of wafers during handling. The fork body design incorporates aerodynamic principles, ensuring the load while avoiding the impact of internal stress on the wafers, making it a "safety guard" in the wafer handling process. 

V. Wafer Handling Robot: A Precise and Efficient Intelligent Handler 

Wafer transfer robots are key equipment in the front-end processes of the semiconductor industry. They are divided into vacuum robots and atmospheric robots, which respectively meet the requirements of different working environments. The wafer transfer robots of Huzhou Prim Semiconductor adopt negative pressure wafer suction technology to achieve pollution-free transfer. The end effectors are made of ceramic materials, ensuring high cleanliness and high stability. 

The equipment features high precision, high efficiency and high reliability. It accurately transfers wafers between different process equipment and storage units through multi-axis robotic arms. The robotic arms are equipped with high-precision angle sensors and laser ranging technology, which can monitor the position, angle and transfer path of the wafers in real time, ensuring that the end effector stably grasps the wafers and avoiding errors and damages caused by manual operation. 

Meanwhile, the robotic arm is integrated with an intelligent control system, which can automatically adjust the grasping strategy and transportation speed based on the size, material and thickness of the wafers. By analyzing the operation data of the equipment through deep learning, it can predict faults in advance and trigger maintenance, reducing downtime. Its optimized motion trajectory planning ensures the smoothness of the transportation process, avoiding any impact or vibration on the wafers. 

VI. Future Outlook: Pioneering Force in Domestic Substitution 

Against the backdrop of a domestic production rate of less than 10% for semiconductor equipment components, Huzhou Primex Semiconductor has achieved a breakthrough in providing a full-process solution from nanometer-level ultra-precision motion control to wafer processing, relying on its independently developed core technologies. The company's products have been adopted by over 30 domestic customers, with hundreds of sets of equipment delivered, and its end-users include leading domestic semiconductor enterprises. 

With the continuous growth in global demand for precision equipment in the semiconductor industry and the accelerated process of domestic semiconductor industry's self-reliance and control, Huzhou Prim Semiconductor is expected to become a core force in the replacement of domestic semiconductor precision equipment by leveraging its technological advantages and production capacity. In the future, the company will continue to increase its investment in research and development, aiming to improve the positioning accuracy of its next-generation products to within 30 nanometers, thereby injecting stronger momentum into the rise of domestic semiconductor equipment.