Huzhou Prim Semiconductor: Nanoscale Precision Technology Empowers a New Era in Semiconductor Manufacturing

As semiconductor manufacturing progresses towards 3nm and lower process technologies, the processing accuracy of wafers has been enhanced to the nanometer level, presenting unprecedented challenges to equipment performance.

Huzhou Prim Semiconductor: Nanometer-level Precision Technology Sets New Era for Semiconductor Manufacturing

As semiconductor manufacturing progresses towards 3nm and lower process technologies, the processing accuracy of wafers has been enhanced to the nanometer level, presenting unprecedented challenges to equipment performance.

Huzhou Prim Semiconductor: Precision Motion Platform Design Leads the Innovation of Wafer Handling Technology

As semiconductor manufacturing progresses towards 3nm and lower process technologies, the precision requirements for wafer handling and calibration have risen to the nanometer level.

Huzhou Prim Semiconductor: Leading the Precision Revolution in Wafer Manufacturing with Air-Floating Technology

In the process of semiconductor manufacturing moving towards 3nm and below process technologies, the precision requirements for wafer handling, alignment, and positioning have been raised to the nanometer level.

The core components of semiconductor equipment and the industrial practice of Huzhou Prim: A new chapter in wafer processing technology

On the high-precision stage of semiconductor manufacturing, wafer handling equipment functions as the conductor of a precise symphony orchestra, ensuring harmony and efficiency in every step.