Amid the global semiconductor industry's accelerating trend towards high-end and intelligent development, Chinese semiconductor equipment enterprises are breaking foreign technological monopolies through independent innovation and promoting the realization of industrial autonomy and control. Huzhou Prim Semiconductor Co., Ltd. (hereinafter referred to as "Prim Semiconductor"), as an innovation pioneer in the domestic semiconductor equipment field, has been focusing on nanometer-level ultra-precision motion control technology since its establishment in 2023. By taking core equipment such as precision motion stages, wafer aligners, wafer alignment stages, and ceramic wafer forks as the key points, it has built a complete set of precision solutions for the entire wafer processing process, injecting strong impetus into the rise of domestic semiconductor equipment. 

I. Precision Motion Stage: The "Precise Hands and Feet" of Semiconductor Manufacturing 

Precision motion stages are an indispensable part of modern manufacturing equipment. Their design and implementation directly affect the speed and accuracy of processing equipment. They are core components of semiconductor manufacturing equipment such as lithography machines and etching machines, as well as back-end packaging equipment such as die bonders and wire bonders. The performance of the motion platform determines the overall performance of the equipment. 

The precision motion stage design of Prim Semiconductors fully takes into account multiple key factors such as load capacity, motion accuracy, and response speed. The company's RBN series of single-axis precision motion stages are composed of worm-like crossed roller guides, linear motors, and grating closed-loop feedback systems. The stroke range covers 25 millimeters to 300 millimeters. The bidirectional repeat positioning accuracy can reach ±50 nanometers, the straightness is ±0.3 micrometers, the flatness is ±0.4 micrometers, and the yaw is controlled between ±1.75 arc seconds and ±2.25 arc seconds. The structure is compact and is widely used in wafer processing and inspection, femtosecond laser processing, optical storage testing and measurement, and other fields. 

In terms of drive mode, Prim Semiconductor adopts advanced linear motor direct drive technology. Compared with the traditional AC servo motor and ball screw drive method, the linear motor does not require mechanical transmission links, has no frictional resistance and no transmission clearance, and features a simple structure, high rigidity, fast response, and a wide speed regulation range. It can achieve a greater response speed and smaller positioning accuracy. Meanwhile, the company's precision motion stage also employs air floatation technology, which separates the worktable from the base through a gas layer, significantly reducing friction, lowering equipment wear, and effectively isolating the influence of external vibrations, providing a more stable working environment for high-precision semiconductor manufacturing. 

II. Ceramic Wafer Fork: The Gentle Guardian of Wafer Transfer 

As a core component of the wafer loading system, the ceramic plate fork's material and structural design directly affect the stability of wafer transmission. In the semiconductor manufacturing process, wafers serve as the foundation of chips, and any minor damage to their surface can lead to a decline in chip performance or even failure. Therefore, the safety and stability of the wafer transmission process are of critical importance. 

Prim Semiconductor's ceramic wafer forks are made of high-purity zirconia ceramic material, which features high-temperature resistance and corrosion resistance, enabling it to withstand the complex environment in the semiconductor manufacturing process. Additionally, the company's three-point edge clamping design prevents wafer deformation or damage during the transfer process. This adaptive clamping structure is compatible with wafers of different sizes and significantly reduces the risk of manual intervention, ensuring that the wafers remain stable throughout the transfer process. 

Compared with traditional metal sheet forks, ceramic sheet forks have better insulation performance and chemical stability, which can effectively prevent wafers from being affected by static electricity and chemical corrosion during the transmission process, further enhancing the safety and reliability of wafer transmission. In addition, the lightweight design of ceramic sheet forks can also reduce inertia during movement, improving transmission speed and accuracy. 

III. Wafer Aligner: The "Precision Navigation" of Lithography Process 

The wafer alignment stage is a key piece of equipment in semiconductor lithography processes. It uses high-precision optical sensors and laser measurement technology to monitor the positional deviation of the wafer in real time and automatically correct it through fine-tuning mechanisms, ensuring that the wafer is in the optimal position in the processing center. This technology significantly enhances the integration density and yield of chips and is widely applied in high-end lithography and etching machines. 

Prim Semiconductor's wafer alignment stage adopts an air-floatation rotating shaft design, eliminating the friction loss of traditional mechanical contact and achieving nanometer-level positioning accuracy, providing a reliable guarantee for processes below 3nm. During the alignment process, the wafer alignment stage uses a high-resolution imaging system to monitor the wafer's positioning in real time. Through a computer control system, the angle and position of the stage surface are adjusted to achieve micrometer or even nanometer-level alignment accuracy. This high-precision alignment is crucial for subsequent lithography processes, ensuring that the lithography patterns are accurately transferred to the wafer surface. 

In addition to the traditional semiconductor manufacturing field, wafer alignment stages are increasingly playing a core role in advanced manufacturing technologies such as 3D integrated circuits, MEMS, and optoelectronics. With the continuous advancement of semiconductor manufacturing technology, the requirements for the accuracy and speed of wafer alignment stages are also getting higher and higher. Prim Semiconductor continuously innovates its technology to enhance the performance of wafer alignment stages to meet market demands. 

IV. Wafer Aligner: The Gatekeeper at the Entrance of Semiconductor Manufacturing 

Wafer aligners are crucial equipment for ensuring the accurate position and angle of wafers during various processing steps. Through precise measurement and adjustment, aligners can correct errors caused by equipment deviations or improper operation, ensuring that wafers achieve the best production results in processes such as lithography and etching. In semiconductor manufacturing, wafers undergo multiple complex process steps, including lithography, etching, and ion implantation, and each step has extremely high requirements for the positioning accuracy of wafers. If the positioning of wafers is inaccurate, it may lead to deviations in circuit patterns, degradation of chip performance, or even the failure of the entire chip. 

Prim Semiconductor's wafer aligner mainly relies on high-precision sensors and image processing systems to achieve the positioning of wafers. First, the sensors detect specific marks or patterns on the wafer surface, which are usually designed in advance for calibration. Then, through image processing algorithms, these marks are analyzed and identified to determine their precise positions on the wafer. Next, the aligner calculates the required adjustment amount for the wafer based on preset parameters and algorithms. Finally, the wafer is precisely adjusted to the correct position through a sophisticated drive mechanism, completing the calibration process. 

The company's wafer aligner adopts a variety of advanced technologies and processes. In terms of sensors, it uses high-resolution optical sensors or electron beam sensors to obtain clearer and more accurate images. In image processing, it employs complex algorithms to quickly and accurately identify marks and calculate position information. Meanwhile, the drive mechanism also features high precision and stability, ensuring a smooth and precise adjustment process for the wafers. Additionally, Prim Semiconductor's wafer aligner is equipped with automation and self-adaptation functions, capable of real-time monitoring of the wafer's status, autonomously adjusting its position, minimizing manual intervention to the greatest extent, and enhancing production efficiency. 

V. Collaborative Innovation: Building a Comprehensive Precision Solution for the Entire Wafer Processing Workflow 

The core equipment of Prim Semiconductor does not exist in isolation but collaborates to build a precise solution for the entire wafer processing flow. In the semiconductor manufacturing process, the wafer is first calibrated for position and angle through a wafer aligner to ensure it is in an accurate state when entering the production line; then, a ceramic wafer fork precisely transfers the wafer to a wafer alignment table for further positioning adjustments; finally, a precision motion stage moves the wafer quickly and accurately between various processing equipment to complete a series of processes such as lithography and etching. 

This collaborative innovation model enables Primus Semiconductor's core equipment to achieve greater efficiency and provides semiconductor manufacturing enterprises with a one-stop solution. Meanwhile, the company has also realized the interconnection and data sharing among devices through big data and Internet of Things (IoT) technologies. It can collect real-time operation data of the equipment, conduct status analysis and predictive maintenance, significantly reducing unexpected downtime and losses, and improving overall production efficiency. 

VI. Independent Innovation: The Core Driving Force to Break Foreign Technological Monopolies 

Since its establishment, Prim Semiconductor has been focusing on nanometer-level ultra-precision motion control technology. With a core team composed of PhDs, masters and industry experts, the company has been deeply engaged in the control of complex robot systems and ultra-precision manufacturing processes. The company holds multiple intellectual property rights, including 5 registered trademarks, 6 patent information, and 6 software copyrights. The possession of these intellectual property rights indicates that the enterprise has strong strength and innovation capabilities. 

Against the backdrop of the long-term monopoly of the global semiconductor equipment market by foreign enterprises, Prim Semiconductor has achieved the domestic substitution of core equipment through independent innovation and continuous breakthroughs in technical bottlenecks. The company's products have not only been widely applied in the domestic market but also gradually entered the international market, making contributions to the development of the global semiconductor industry. 

In the future, as the semiconductor industry continues to develop, the demand for precision equipment will keep growing. Prim Semiconductor will continue to adhere to independent innovation, constantly improving the performance and quality of core equipment, expanding the application fields of products, and injecting a continuous stream of impetus into the independent control of domestic semiconductor equipment and the development of the global semiconductor industry.