As semiconductor manufacturing progresses towards 3nm and lower process technologies, the processing accuracy of wafers has been enhanced to the nanometer level, presenting unprecedented challenges to equipment performance. Huzhou PrimTech Semiconductor Co., Ltd., relying on its independently developed precision motion platform, wafer alignment platform, ceramic fork, and wafer loading system, has established a complete nanometer-level technology matrix. This not only fills the gap in domestic high-end semiconductor equipment but also drives global semiconductor manufacturing towards higher precision and efficiency. 

Core technology breakthrough: From wafer alignment to precise loading 

Wafer alignment station: The guardian of nanometer-level precision 

The wafer alignment station is a crucial equipment in the semiconductor lithography process. It uses high-precision optical sensors and laser measurement technology to continuously monitor the position deviation of the wafer and automatically correct it through a fine-tuning mechanism, ensuring that the wafer is in the optimal position in the processing center. This technology significantly improves the integration and yield of chips, and is widely used in high-end lithography machines and etching machines. Prim's alignment station adopts an air-floating rotating shaft design, eliminating the friction loss caused by traditional mechanical contact and achieving nanometer-level positioning accuracy, providing a reliable guarantee for processes below 3nm. 

Wafer Calibrator: Intelligent Compensation for Dynamic Errors 

During the wafer processing, dynamic error compensation is crucial for ensuring processing accuracy. Prim's wafer calibrator monitors the position and posture of the wafer in real time, combined with advanced algorithm models, to predict and compensate for the dynamic errors during the processing. This intelligent compensation mechanism not only improves processing accuracy but also reduces the scrap rate, providing strong support for the efficient and stable operation of semiconductor manufacturing. 

Ceramic spatula: The stable foundation for wafer transfer 

The ceramic disc fork, as the core component of the wafer loading system, its material and structural design directly affect the transmission stability of the wafer. The ceramic disc fork of Prim uses high-purity zirconia ceramic, which has the characteristics of high temperature resistance and corrosion resistance. At the same time, through the three-point edge clamping design, it avoids the deformation or damage of the wafer during the transmission process. This adaptive clamping structure is not only compatible with different sizes of wafers, but also significantly reduces the risk of manual intervention. 

Wafer loading system: The seamless connector for efficient production 

The wafer loading system is the "glue" that connects various stages in the semiconductor production line. It uses pneumatic or electric transmission devices to precisely transfer wafers from one process to another. Prim's EFEM (Equipment Front-end Module) loading system integrates a robotic arm and multiple positioning devices, combined with intelligent recognition technology, to monitor the wafer status in real time and ensure zero errors during the transfer process. This system has increased production efficiency by 20% - 30% while reducing the wafer damage rate. 

The synergy of the technology matrix: From the laboratory to mass production 

Prim's nanoscale technology matrix is not isolated but achieves collaborative optimization through precise motion platforms. For instance, during wafer calibration, the alignment platform and the air-floating motion platform are linked. Real-time data is provided by laser sensors, and the control system automatically adjusts the motion trajectory to ensure the absolute precision of the wafer during the processing. This collaborative design not only shortens the production cycle but also reduces equipment maintenance costs. 

Innovation-driven: From Core Technologies to Market Applications 

Prim's technological innovations are not only reflected in the research and development of core components, but also in the integration and optimization of the entire machine equipment. The company has built a complete nanoscale technology matrix through its own-developed precision motion platform, air-floating rotating shafts, and other core equipment, filling the gap in domestic high-end semiconductor equipment. At the same time, the company has established close R&D partnerships with many well-known research institutions at home and abroad, jointly promoting the research and commercial application of core technologies. 

Future Outlook: Continuously Leading the New Trends in Semiconductor Manufacturing 

With the continuous advancement of semiconductor manufacturing technology, Prim will continue to increase its research and development investment, promoting the innovation and application of nanoscale precision technology. The company plans to further enhance its production and research capabilities through measures such as building new factories and purchasing advanced equipment, and continuously expand its market share. At the same time, Prim will also strengthen cooperation with domestic and foreign customers, jointly explore new fields and applications in semiconductor manufacturing, and contribute more Chinese wisdom and solutions to the development of the global semiconductor industry. 

Huzhou Prim Semiconductor Co., Ltd., with its outstanding performance in the field of nanoscale precision technology, is emerging as a new force in the global semiconductor manufacturing sector. In the future, with continuous technological breakthroughs and the expansion of the market, Prim is expected to occupy a more significant position in the global semiconductor industry.