Deeply cultivating semiconductor precision components: Huzhou Pulim empowers the localization of wafer transmission with core products such as air-bearing rotary axes

As the semiconductor manufacturing industry accelerates towards high precision and high localization, Huzhou Pulim Semiconductor Co., Ltd., located in Xihu Science and Technology Innovation Park, Si'an Town, Changxing County, Huzhou City, Zhejiang Province, is emerging as a cutting-edge force in the domestic semiconductor equipment supporting sector, leveraging its technological expertise in precision motion control and wafer transmission. This small and micro enterprise, established in 2023, has been anchoring its focus on the research and development of key components in the core semiconductor processes since its inception. It has been continuously delving into core products such as air-bearing rotary axes, ceramic fork, wafer loading system, and wafer transfer system, providing reliable localization support for the stable operation of domestic semiconductor production lines.

As the core component of semiconductor precision motion platforms, the performance of air-bearing rotary axes directly determines the upper limit of accuracy in detection and processing stages. Unlike traditional mechanical contact rotary structures, air-bearing rotary axes rely on a uniform gas film formed by high-pressure gas to achieve contactless operation, reducing friction loss during operation to near zero. They can achieve nanometer-level repeatable positioning accuracy and are widely compatible with semiconductor-specific equipment such as direct-drive nanometer air-bearing turntables and high-precision coordinate measuring machines. In processes such as lithography and detection, which require extremely high motion stability, air-bearing rotary axes can maintain extremely low vibration levels for extended periods, avoiding micro-particle contamination caused by mechanical wear. They fully meet the ultra-clean environmental requirements of ISO Class 1 for semiconductor manufacturing and are the core basic components that ensure high yield in high-end processes.

Ceramic wafer fork, as the core actuator in wafer transfer, is a critical component that directly contacts the wafer. Its material properties and machining precision directly impact wafer safety. The wafer fork, crafted from high-performance engineering ceramics, boasts extremely low electrostatic discharge characteristics, superior structural rigidity, and an extremely low thermal expansion coefficient. During high-speed wafer retrieval and placement, it not only prevents scratches and electrostatic damage to the wafer surface but also maintains stable form and position accuracy amidst minor temperature fluctuations. Compared to traditional metal wafer forks, ceramic wafer forks offer a several-fold increase in service life and significantly reduce the risk of wafer debris during transfer. They are compatible with the retrieval and placement needs of wafers of different sizes, including 6-inch, 8-inch, and even 12-inch wafers, serving as a crucial guarantee for achieving micron-level precision in wafer transfer operations.

As the external interface of the semiconductor front-end automation production line, the wafer loading system plays a crucial role in connecting external wafer storage with internal process equipment. It is responsible for completing the docking, unlocking, wafer status recognition, and safety gate switch feedback of wafer cassettes. It not only directly determines the overall loading and unloading efficiency of the equipment but also affects the operational rhythm of the entire production line. A mature wafer loading system can support multi-station collaborative operations, with comprehensive real-time status feedback and abnormal warning functions. It can achieve seamless connection of wafers from the storage end to the process end while isolating them from external contamination, ensuring the environmental cleanliness and status integrity of wafers before they enter the processing stage.

The EFEM (Electronic Front-end Module) serves as the "smart gateway" for the front-end semiconductor manufacturing process. It systematically integrates wafer robots, loading ports, aligners, and intelligent control systems, functioning as the core bridge for wafer flow between different process equipment. A high-performance EFEM can complete automatic wafer transmission, path planning, and task scheduling in an ultra-clean environment, achieving a repeatable positioning accuracy of ±0.1 millimeters, which is much lower than the diameter of an ordinary human hair. It not only enables efficient wafer flow between hundreds of process equipment but also monitors the operating status in real time through various integrated sensors, interfaces with the factory MES system to complete full-process data traceability, and significantly reduces the pollution and error risks caused by manual operations. It is an indispensable core component of a modern fully automated wafer fab.

Relying on its continuous investment in technology research and development and precision manufacturing, Huzhou Pulim Semiconductor has deeply integrated the high-precision motion characteristics of air-bearing rotary axes and the high reliability advantages of ceramic chip forks with the systematic integration capabilities of wafer loading and wafer transfer systems, forming a complete product matrix covering the front-end transmission links of semiconductors. Against the backdrop of continuous adjustments in the global semiconductor industry chain structure, such domestic enterprises focusing on niche markets are gradually injecting solid underlying momentum into the autonomous and controllable development of the domestic semiconductor industry through continuous technological iteration.