As semiconductor manufacturing progresses towards 3nm and lower process technologies, the precision requirements for wafer handling and calibration have risen to the nanometer level. Huzhou PrimTech Semiconductor Co., Ltd. has built a complete nanometer-level technology matrix through its own-developed core equipment such as wafer calibrators, ceramic fork arms, wafer transfer systems, and precision motion platforms, filling the gap in domestic high-end semiconductor equipment and driving global semiconductor manufacturing towards higher precision and efficiency. 

I.  Core Technology Breakthrough: Precise Coordinated Operation from Calibration to Handling 

1. Wafer calibrator: The "eyes" for nanometer-level positioning 

The wafer aligner is a crucial component in the lithography process. It achieves precise alignment between the wafer and the photomask through the collaboration of optical sensors and mechanical structures. Prim's aligner employs multi-degree-of-freedom adjustment technology, utilizing piezoelectric ceramics for nanometer-level positioning accuracy. It integrates a laser interferometer and a visual sensor to continuously monitor the wafer position and perform closed-loop control, ensuring that the alignment error is less than ±5nm. For instance, its patented wafer adaptive three-point edge clamping device designs a three-point clamping structure that is compatible with different-sized wafers and has minimal impact on the wafer shape, ensuring stability and reliability. 

2. Ceramic disc fork: The "arm" for high-precision transmission 

The ceramic disc fork, as the core component for wafer handling, its material selection and design directly affect the transmission efficiency and wafer safety. The ceramic disc fork of Prim uses alumina or silicon nitride ceramics, which have high purity, high density and low thermal expansion coefficient. It can avoid metal impurities contamination in equipment such as etching machines. At the same time, through the combination of vacuum suction and mechanical clamping technology, it realizes wafer non-contact grasping and avoids edge damage. Its structural design takes into account both lightweight and rigidity, maintaining nanometer-level jitter during high-speed transmission. 

3. Wafer transfer system and precision motion platform: The "skeleton" of automated transfer 

The wafer transfer system is responsible for the transportation of wafers between equipment, and its performance directly affects the production cycle and the wafer damage rate. Prim's transfer system adopts air-floating rotating shaft technology, achieving non-contact rotation through air bearings, eliminating the friction and wear problems of traditional mechanical bearings, and the rotational accuracy reaches sub-micron level. The precision motion platform uses a six-axis motion platform (X/Y/Z translation and rotation around axes), dynamically adjusting the path through an intelligent feedback system to avoid collisions with the internal structure of the equipment, and the transfer speed can reach more than 30 wafers per minute. For example, its wafer position calibration device patent realizes rapid wafer position calibration through the collaboration of a pressure sensor group and the driving roller, without the need to open the chamber to take wafers, significantly improving production efficiency. 

II. Synergistic Effects of the Technology Matrix: From Single Point Breakthrough to System Innovation 

Prim's technology matrix is not isolated but rather achieves comprehensive coverage of the wafer processing process through the synergy of precise mechanical structures and intelligent control systems. For instance, after the wafer aligner completes positioning, the ceramic fork and transfer system can seamlessly connect, transporting the wafer to etching or lithography equipment; while the precise motion platform ensures that the wafer remains in a nanometer-level stable state throughout the transfer process. This synergy not only enhances equipment compatibility but also drives semiconductor manufacturing towards higher precision and efficiency. 

III. Industry Impact: From Domestic Absence to Global Leadership 

Prim's technological breakthrough has filled the gap in domestic high-end semiconductor equipment. Its core devices such as wafer calibrators and ceramic fork plates have been widely applied in front-end process equipment like photolithography machines and etching machines. For instance, in the manufacturing of wafers with 3nm and below processes, Prim's nanoscale technology matrix can significantly improve chip yield and reduce production costs. At the same time, its patent layout covers key links such as wafer calibration, clamping, and transmission, providing a replicable technical path for the industry. 

IV. Future Outlook: Continuous Innovation and Ecological Construction 

Looking to the future, Prim will continue to deepen its research and development in nanotechnology, expanding the application of wafer calibrators in new materials such as transparent and semi-transparent wafers. At the same time, by collaborating with upstream and downstream enterprises, it will build a complete ecosystem chain from materials, equipment to processes, promoting the development of semiconductor manufacturing towards higher integration and lower energy consumption. For example, its wafer calibration device patent has been applied to lithography machines. Through the collaboration of the supporting platform and the calibration holes, it achieves dual calibration of the center and flat edges of the wafer, meeting the requirements of efficient production. 

Huzhou Prim Semiconductor Co., Ltd. leverages nanoscale technology as its foundation to drive the innovation of semiconductor manufacturing equipment. From the precise positioning of wafer calibrators, to the highly clean transmission of ceramic wafers, and to the collaborative control of transfer systems and motion platforms, Prim's technological matrix is facilitating the advancement of global semiconductor manufacturing towards higher precision and greater efficiency in the future.